Qualcomm is being light on details, but it today announced that its next-generation Snapdragon Mobile Platform is now shipping to customers. We had heard earlier this year that the chip was in production, so it makes sense that the first samples would be heading out so partners could qualify the chip for use in their upcoming products.
The next-generation SoC is built on a 7nm process after staying at 10nm for two generations (Snapdragon 835 and Snapdragon 845). It was initially reported that the chip would carry the designation Snapdragon 855, but a recent report suggests that it will instead be called the Snapdragon 8150. Qualcomm is reportedly switching up its naming scheme to differentiate its smartphone SoCs from those that are designed for “Always Connected” Windows 10 PCs.
The new Snapdragon SoC will incorporate the Snapdragon X24 LTE modem, which is a Cat 20 part supporting 2Gbps downlink speeds. Qualcomm also confirmed that its new SoC can be paired with the new Snapdragon X50 5G modem to deliver a “premium tier” for smartphones and mobile devices. It’s likely that this is the chip combination that LG will be using when it releases its first 5G-capable smartphone during the first half of 2019.
“We are very pleased to be working with OEMs, operators, infrastructure vendors, and standards bodies across the world, and are on track to help launch the first 5G mobile hotspots by the end of 2018, and smartphones using our next-generation mobile platform in the first half of 2019,” said Qualcomm Incorporated President Cristiano Amon.
“Qualcomm Technologies’ continued leadership in research and engineering allows for a future of increased innovation across multiple sectors as 5G connectivity becomes ubiquitous.”
If Qualcomm sticks to its usual release schedule, we should be hearing our first details about the next Snapdragon Mobile Platform in early December.